| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Electromigration Study of Flip Chip Packages under Extra-high Current Density Tests with Temperature Control |
| Author(s) |
Jia-Hong Ke, Yu-Wei Lin, C. R. Kao |
| On-Site Speaker (Planned) |
Jia-Hong Ke |
| Abstract Scope |
Electromigration phenomenon in flip chip solder joints under high temperature conditions has been widely studied. However, electromigration tests were seldom carried out under proper temperature control. In this study, a cooling system with a PID controller was applied in order to maintain the chip temperature at 60 degree C, and different extra-high current densities (5.5×10<SUP>4</SUP> A/cm<SUP>2</SUP>, 5.0×10<SUP>4</SUP> A/cm<SUP>2</SUP>, and 4.5×10<SUP>4</SUP> A/cm<SUP>2</SUP>) were used. The objective of this study is to investigate the effects of controlled temperature and extra-high current density on flip chip solder joints. The results showed that low controlled temperature could retard void formation in solder joints even under extra-high current density tests. Instead, substantial IMC dissolution at the cathode and IMC accumulation at the anode was observed. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |