|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||A Study of Microstructure, Electronic Flame-off Characteristics and Electrical Properties of 15um Ag-Pd-Au-Pt (APAP) Alloy Wires
||Che-Wei Hsu, Fei-Yi Hung, Truan-Sheng Lui
|On-Site Speaker (Planned)
In this study, a 0.6 mil Ag-2.5Pd-1.5Au-0.15Pt alloy wire (APAP) was selected as the bonding wire material. Platinum element is added to have better strength in pull-test and ability to endure high temperature during the electrical test. The elements distribution of the free air ball (FAB) and electrical properties of APAP wire were investigated. Element distribution in the FAB plays a key role in the first bonding process. The results show Pd-rich dendrite can be observed in the FAB, while the other three elements distribute uniformly. In the measurement of electrical properties, the fusion current of APAP wire has little decrease after high current and long-term use. Accordingly, APAP wire can be a promising candidate for wire bonding.
||Planned: Supplemental Proceedings volume